High precision visual labeling machine: cracking the "micrometer level" technical password for precision bonding of electronic auxiliary materials

abstract
In high-end manufacturing fields such as 5G communication, new energy, and semiconductors, the precision bonding operation of electronic auxiliary materials directly affects product performance and yield. Faced with the micro level mounting requirements of conductive adhesive, insulation film, shielding materials, etc., traditional labeling processes are no longer able to meet the dual challenges of accuracy and efficiency. The visual labeling system of Longhai Huanyu LHVT2.0 achieves ± 0.1mm precision alignment through AI visual positioning dynamic compensation technology, providing a highly reliable automation solution for electronic auxiliary material production.

1、 The precision dilemma of electronic auxiliary material bonding

The field of electronic manufacturing is facing three core challenges:
1. The trend of miniaturizationFPC flexible circuit board auxiliary material size reduced to 5mm ², traditional mechanical positioning error exceeds ± 0.3mm
2. The surge of irregular partsThe qualification rate of OCA adhesive and irregular heat sink bonding for curved screens is less than 80%
3. material sensitivityArtificial installation of nano silver wire conductive film can easily cause creases, resulting in resistance fluctuations exceeding 15%

According to data from a leading PCB manufacturer, rework costs caused by deviations in the bonding of auxiliary materials account for 12% of manufacturing costs, and a 0.1mm increase in accuracy can increase product pass rates by 18%. The industry urgently needs to break through the traditional mode of "human eye recognition mechanical positioning".

2、 The technological breakthrough path of visual labeling machine

The LHVT2.0 series equipment uses the "3D perception dynamic tracking" technology matrix to construct an accurate moat for electronic auxiliary material bonding:

1. Micro scale visual positioning system
-Equipped with a 5-megapixel CMOS camera and a 10 μ m telephoto lens, it can recognize 0.02mm ² micro marker points
-Using deep learning algorithms, the recognition accuracy of reflective/transparent materials (such as PI film) reaches 99.7%
-Support multi feature point matching technology to cope with local deformation and positional deviation of electronic auxiliary materials

2. Dynamic compensation execution mechanism
-The linear motor drive platform achieves a response speed of 0.8ms and a dynamic correction accuracy of ± 0.03mm
-Six axis robotic arm flexible adaptation for curved workpieces, with curvature radius compatible with R3mm-R2000mm
-The pressure sensing mounting head ensures zero pressure damage to auxiliary materials and a contact pressure control accuracy of ± 2g

3. Intelligent process management system
-Built in 200 electronic auxiliary material process database, one click access to parameters such as graphene film/electromagnetic shielding film
-Real time monitoring of mounting temperature by infrared thermal imaging module to prevent deformation of thermal conductive adhesive due to temperature rise
-Deep integration with MES system to achieve SPC process control and quality traceability

3、 Typical application scenario analysis

Scenario 1: Conductive adhesive mounting of microelectronic components
- pain point0402 packaging resistor requires precise dispensing in the 1.0mm × 0.5mm area, with a manual microscope operation efficiency of only 15pcs/h
- Solution：
① Capture pad boundaries using a 12 μ m resolution optical system
② Double closed-loop control system achieves control of rubber road width ± 0.01mm
③ Complete 1200 installations per hour with a positional deviation rate of less than 0.5 ‰

Scenario 2: OCA optical adhesive bonding for flexible display screens
- pain pointThe occurrence rate of bubbles in the 7-inch curved screen is over 5%, and the material loss caused by repair is 30%
- Innovative solutions：
① 3D visual modeling technology generates surface fitting trajectories
② Vacuum adsorption platform eliminates material stress and deformation
③ Real time removal of micrometer sized bubbles by online AOI detection system
④ Yield increased to 99.2%, material utilization increased by 25%

Scenario 3: Automated application of insulation film for power batteries
- pain pointThe folding of the 0.2mm thick blue film on the surface of the battery cell caused the failure of the withstand voltage test
- technological breakthrough：
① Multispectral detection and identification of surface irregularities in battery cells
② Tension control system maintains consistency in film extension
③ Adaptive adjustment of contact angle to avoid edge warping
④ Realize continuous production with zero defects for 8 hours

4、 Industry empirical data

•A semiconductor packaging and testing enterpriseImporting 12 LHVT2.0 series devices, increasing the CPK value of QFN packaged heat sink mounting from 0.8 to 1.67

•New energy vehicle component manufacturersInsulation board labeling speed reaches 180 pieces/minute, reducing production line labor costs by 70%

•Consumer Electronics Contract FactoryThe bonding yield of TWS earphone conductive fabric has jumped from 82% to 98.5%, saving material costs of over 3 million yuan annually

5、 Technological Evolution Direction

1. Breakthrough in nanoscale precisionDeveloping submicron optical systems to meet the mounting requirements of third-generation semiconductor materials

2. Multi physics field coupling controlIntegrated temperature/humidity/electrostatic protection module to meet special working conditions in clean workshops

3. Digital Twin SystemShorten device import cycle by 60% through virtual debugging technology

Conclusion
In the process of moving towards the "micro era" in electronic manufacturing, Longhai Huanyu's "precision execution of visual algorithms" technology triangle has redefined the accuracy standards for electronic auxiliary material bonding. We sincerely invite electronic manufacturing companies to participate in the "Precision Challenge Program" and welcome free access to customized testing solutions to explore new heights in intelligent manufacturing together.